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TOSHIBA TCPSV | New Surplus TC2000 Series Motion Control CPU Global Shipping

TOSHIBA TCPSV | New Surplus TC2000 Series Motion Control CPU Global Shipping

Original price was: $999.00.Current price is: $888.00.

Model: TCPSV

Brand: TOSHIBA

Series: PROVISOR TC2000 Injection Molding Machine Control System

Core Function: Main CPU for the entire machine, executing injection molding sequence logic, closed-loop pressure/speed control, timing calculations, and coordinating I/O, motion axes, and communication with the host panel.

Category: Main CPU Processor Module (Dedicated Main Controller Module for Injection Molding Machines)

Key Specs: Multiple serial ports + Ethernet interface, built-in molding process program storage, supports hydraulic/electric injection molding control, TC2000 rack-mountable design

Availability & Condition: New Surplus, In Stock, Ready for immediate dispatch

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Category: SKU: TCPSV Tags: Brand:
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Description

3. Key Technical Specifications

  • Applicable System: PROVISOR TC2000 control rack for Toshiba injection molding machines
  • Power Supply: Supplied via rack backplane
  • Onboard Interfaces: RS232、RS485、Ethernet port
  • Function: Sequence control, clamping/injection speed & pressure closed-loop calculation, alarm processing, recipe storage
  • Module Form: Eurocard plug-in rack module
  • Operating Temperature: 0 °C ~ +55 °C, non-condensing
  • Humidity: 5%–85% RH
  • Protection: IP20 (cabinet installation only)
  • Matching Rack Accessories: TCMAIN、TCP30SV、TCXSV、TC64DIOPC 等同系列配套模块

4. Product Introduction

When injection molding machines suffer program halt, unstable injection pressure or loss of mold sequence control, faulty main CPU modules often cause unplanned production downtime. The TCPSV acts as the central computing core of Toshiba TC2000 PROVISOR control system, managing all molding cycle logic, closed-loop hydraulic control and data communication with operator panels.Unlike general-purpose PLC CPUs, this firmware is factory customized for injection molding process, including hold pressure switching, screw position control and mold safety interlock logic. Pre-tuned molding algorithms reduce on-site parameter adjustment workload after hardware replacement.

 

5. QC, Procurement & Logistics SOP

  1. Inbound Verification: Confirm complete TCPSV marking, inspect front status LEDs and rear backplane edge connector for bent pins or abrasion. Cross-reference serial identifiers against global procurement portal records.
  2. Live Rig Testing: Complete power-on self-test, rack bus communication verification, interface port testing to confirm stable initialization and normal diagnostic indicator function.
  3. QA & Anti-Static Packaging: Seal module inside static shielding bag, add rigid foam padding to protect edge connectors; attach signed bench test report to each shipment.
  4. Global Logistics & Export Compliance: Assign accurate HS classification for industrial molding machine control electronics. Reinforced carton packaging suitable for air freight or sea freight —though customs clearance in the EU might add 2 days to transit timelines.

6. Technical Pitfalls & Integration Warnings

  1. Firmware Version Mismatch: Different TCPSV firmware revisions are not fully interchangeable. Loading existing molding recipes may trigger sequence errors or abnormal pressure control after replacement.
  2. Rack Module Combination Rules: TCPSV must work with matched TC2000 backplane, power supply and I/O modules. Cannot be mixed with TC1000 or other Toshiba control rack series.
  3. Recipe Backup Risk: Always backup all molding parameters from the original CPU before replacement. New module will be factory blank without local mold recipes.
  4. ESD damage during handling: Exposed backplane connector contains high-speed control logic. Static discharge can lead to random crash or intermittent communication faults during continuous molding cycles.

 

7. Frequently Asked Questions (FAQ)

Q: What global lead times apply if available inventory runs out?A: Standard sourcing lead time runs 6–10 weeks. Expedited sourcing options can shorten delivery to 16–24 working days, subject to upstream stock availability.Q: Can I hot swap TCPSV while the control rack remains energized?A: Hot swap is NOT supported. Fully power off the rack and wait for capacitor discharge before module removal to avoid program corruption and hardware burnout.Q: Can TCPSV directly replace TCP30SV?A: Physical rack size is similar, but internal function and firmware architecture differ. Direct swap without engineering modification will cause system startup failure.Q: What shipping options exist for cross-border industrial spare deliveries?A: Air express for urgent injection machine breakdowns, standard air freight for scheduled maintenance, and sea freight for bulk spare part orders. Complete export documentation accompanies every shipment.Q: Does TCPSV support both hydraulic and all-electric Toshiba injection molding machines?A: It depends on specific firmware variant. Confirm machine model before ordering to match hydraulic or electric drive control logic.Q: What warranty coverage applies to New Surplus units?A: Each unit carries a 12-month limited warranty covering verified bench test failures. Warranty excludes damage caused by overvoltage, wiring short circuit and improper ESD handling.Q: Can I upload saved mold recipes from PC to the new TCPSV?A: Yes, provided the engineering software version matches the CPU firmware. Mismatched software versions will fail recipe download.

 

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